Embedded Modules with NXP i.MX Processors

An important criterion for the board selection is the processor performance.
We offer a wide range of NXP processors:

NXP i.MX 8M, i.MX 8M Mini, i.MX 8M Nano, i.MX 8M Plus

Here you will find the right processor for your project - NXP processors are very versatile and offer solutions for the most diverse requirements: extremely low power consumption, high performance for multimedia applications, asymmetric multiprocessing, or artificial intelligence.

We offer solutions for industrial and medical applications.
All our NXP embedded modules are long-term available and we are ISO9001:2015 and ISO13485:2016 certified.

The members of our product families are compatible with each other and suitable for a wide range of requirements. Our armStone product family for example includes powerful PicoITX single board computers, while our tiny (only 35x40mm) PicoCore Computer on Modules also offer particularly power-saving models.

For each of our embedded boards, we offer development kits to enable an easy start of development. This is supported by our free support forum, which is maintained by the F&S engineers. They also help you via e-mail or phone.

All F&S Linux embedded modules are available with Buildroot or Yocto and include the board support package and the toolchain for Bare Metal or FreeRTOS (realtime). F&S publishes up to two software releases per year (update of uboot, kernel, root file system, toolchain).
➜ Learn more about our software solutions

Modules with NXP i.MX 8 Application Processor

The i.MX 8 series is an in function and performance scalable multicore platform that includes processors based on Arm Cortex architecture - including combined Cortex-A53, Cortex-A35, Cortex-M4, and Cortex M7-based solutions for next-level graphics, imaging, audio, video, and safety-critical applications.
We offer this state-of-the-art CPU on all of our current form factors: PicoITX Single Board Computer armStone, as well as our Computers On Module efus and PicoCore.

Click on the board name to get detailed information.

	armStone™MX8M	efus™MX8X	PicoCore™MX8MM	PicoCore™MX8MN	PicoCore™MX8MP	SMARC™MX8M
State	Samples	Samples	Production	Production	Q1/2021	2021
CPU
CPU	NXP i.MX 8M	NXP i.MX 8DualX/ QuadXPlus	NXP i.MX 8M Mini	NXP i.MX 8M Nano	NXP i.MX 8M Plus	NXP i.MX 8M
Core	ARM Cortex-A53 + Cortex-M4	ARM Cortex-A35 + -M4	ARM Cortex-A53 + Cortex-M4	ARM Cortex-A53 + Cortex-M7	ARM Cortex-A53 + Cortex-M7	ARM Cortex-A53 + Cortex-M4
No of Cores	Dual/ Quad	2x, 4x A35 + M4F	1, 2, 4 +M4	1, 2, 4 + M7	2, 4 + M7	Dual/ Quad
Frequency	max. 1,5GHz	1.2GHz	max. 1,8GHz + 400MHz	max. 1,5GHz + 650MHz	max. 1,8GHz + 800MHz	max. 1,5GHz
L2-Cache		512KB (ECC)	512KB	512KB	512KB
GPU	3D GC7000 Lite (4 shader)	2D, 3D (GC7000 Lite, 4 shader)	2D GC328, 3D GCNanoUltra (1 shader)	3D GC7000 UltraLite (2 shader)	3D/2D, ES 3.1/3.0, CL™ 1.2 VG™ 1.1	Vulkan
Video Decode	MPEG2, MPEG4p2 H 263 up to 4Kp60	4Kp30	1080p60 HEVC H.265, VP9, H.264, VP8		1080p60, h.265/4, VP9, VP8, Video Encode: 1080p60, h.265/4	MPEG2, MPEG4p2 H 263 bis 4Kp60
Operating System
Linux	Buildroot Yocto	Buildroot/Yocto (uboot installed)	Buildroot/ Yocto (uboot installed)	Buildroot/ Yocto (uboot installed)	Buildroot/ Yocto (uboot installed)	Yocto
Real Time		FreeRTOS	FreeRTOS	FreeRTOS	FreeRTOS
Memory
Flash	max. 1GB SLC NAND max. 32GB eMMC	max. 512MB QSPI NAND 1MB QSPI NOR max. 64GB eMMC	max. 512MB SLC NAND or max. 32GB eMMC	max. 512MB SLC NAND oder max. 32GB eMMC	max. 32GB eMMC EEPROM	max. 1GB SLC NAND max. 32GB eMMC
RAM	max. 8GB LPDDR4	LPDDR4 32 bit	max. 8GB LPDDR4/DDR3L	max. 8GB LPDDR4/ DDR3L	max. 8GB LPDDR4	max. 8GB LPDDR4
Interfaces
SD-Card	1x optional	external	1x external	2x extern	max. 2x external	1x optional
Ethernet	1x 10/100/1000 Mbit	2x 100/1000Mb (IEEE 1588, AVB)	max. 2x 100/1000Mb opt. RGMII	max. 2x 100/1000Mb opt. RGMII	max. 2x 100/1000Mb opt. RGMII	1x 10/100/1000 Mbit
WiFi	IEEE 802.11a/b/g/n	802.11ac/a/b/g/n	802.11 ac/a/b/g/n		802.11 ac/a/b/g/n	IEEE 802.11a/b/g/n
BT	BT 2.1+EDR, 4.1 LE	5.0 LE with antenna socket	5.0 LE		5.0 LE
USB Host	2x USB 3.0 2x USB 2.0	1x USB 2.0 OTG	1x		1x 2.0/ 3.0	4x
USB Device	1x USB3.0 OTG	1x USB 3.0 OTG	1x OTG 2.0	1x OTG 2.0	1x OTG 2.0/ 3.0	1x OTG
CAN	1x	2x CAN-FD	1x	1x	max. 2x	1x
UART	3x (1x RS232, 2x TTL)	4x	max. 4x	max. 4x	max. 4x	3x (1x RS232, 2x TTL)
I2C	4x	4x	max. 4x	max. 4x	max. 4x	4x
SPI	2x	2x	max. 2x	max. 2x	max. 2x	2x
Audio	Line In/Out/Mic	I2S	Line In/ Out/ Mic/ Headphone/I2S	Line In/ Out/ Mic/ Headphone/I2S	Line In/ Out/ Mic/ Headphone/ I2S	Line In/Out/Mic
Digital I/O	max. 32					max. 32
Touch Panel	analog reistive and PCAP Touch ext. via I2C	analog resistive and PCAP Touch ext. via I2C	analog resistive and PCAP touch ext. via I2C	analog resistive and PCAP Touch ext. via I2C	analog resistive and PCAP Touch ext. via I2C	analog reistive und PCAP Touch ext. via I2C
Camera analog/digital	0/MIPI-CSI	0/MIPI-CSI2/ Parallel 8bit	MIPI CSI	MIPI-CSI	max. 2x MIPI-CSI	0/MIPI-CSI
PCIe	1x with SIM Card Slot	1x PCIe 3.0 (1 lane)	1x		1x	1x mit SIM Card Slot
RTC		on board/ external IC	1x external IC	1x external IC	CPU or external IC	
additional Interfaces			max. 4x PWM, Watchdog, SPDIF, ESAI, SAI, SSI	max. 4x PWM, SPDIF, ESAI, SAI, SSI	max. 4x PWM, SPDIF, ESAI, SAI, SSI	BT 2.1+EDR, 4.1 LE
Display
LVDS	2x 24bit	2x 24bit/1080p opt. 2x 24bit/1080p via MXM2	1-2x 24bit	1x 24bit	1-2x 4 Lanes or 1x 8 Lanes	2x 24bit
CRT/DVI	0/DVI				-/1x	0/DVI
MIPI-DSI		2x 4 lanes/1080p via MXM2	1x 4 Lanes	1x 4 Lanes	1x 4 Lanes
Common
Supply Voltage	5V DC/±5%	+5VDC/ ±5%	+3.8V bis 5.5VDC	+3.8V bis 5.5VDC	+3.8V bis 5.5VDC	5V DC/±5%
Power Consumption	tbd	3W typ.	3W typ.	2W typ.	3W typ.	tbd
Operating Temperature	0°C - +70°C opt. -20°C - +85°C	0°C - +70°C -20°C - +70°C -40°C - +85°C	0°C - +70°C opt. -20°C - +85°C	0°C - +70°C opt. -20°C - +85°C	0°C - +70°C opt. -20°C - +85°C opt. -40°C - +85°C	0°C - +70°C opt. -20°C - +85°C
Size	100x72x15mm (LxBxH)	47x62.1x11mm (LxBxH)	35x40mm (LxB)	35x40mm (LxB)	35x40mm (LxB)	82x50mm (LxB)
Weight	~60g	~15g	~10g	~10g	~10g	~40g
Long Term Availability	2033	2035	2034	2034	2035	2028
	armStone™MX8M	efus™MX8X	PicoCore™MX8MM	PicoCore™MX8MN	PicoCore™MX8MP	SMARC™MX8M

Modules with NXP i.MX 6 Application Processors

The i.MX 6 series is a scalable multi-core platform that includes single, dual and quad-core processors based on the ARM CortexA9 architecture.

Click on the board name for detailed information.

	armStone™A9	armStone™A9r2	efus™A9	QBlissA9	QBlissA9r2	PicoMODA9
State	Production	Production	Production	Production	Production	Production
CPU
CPU	NXP i.MX 6	NXP i.MX 6	NXP i.MX 6	NXP i.MX 6	NXP i.MX 6	NXP i.MX 6
Core	ARM Cortex-A9	ARM Cortex-A9	ARM Cortex-A9	ARM Cortex-A9	ARM Cortex-A9	ARM Cortex-A9
No of Cores	Solo/DualLite/Quad	Solo/DualLite/Quad	1, 2, 4	Solo/DualLite/Quad	Solo/DualLite/Quad/QuadPlus	Solo/DualLite
Frequency	max. 1.2GHz	max. 1GHz	max. 1GHz	max 1.2GHz	max 1GHz	max. 1.2GHz
L2-Cache	max. 1MB	max. 1MB	max. 1MB	max. 1MB	max. 1MB	max. 1MB
GPU	2D, 3D 600Mpix/s	3D, 2D 600Mpix/s	2D, 3D	2D 600Mpix/s	3D 1000Mpix/s	2D 600Mpix/s
Video Decode	1080p60	1080p60	1080p60	1080p60	1080p60	1080p60
Operating System
Linux	Buildroot Yocto	Buildroot Yocto	Buildroot Yocto (uboot installed)	Buildroot Yocto	Buildroot Yocto	Buildroot Yocto
Windows	WEC 7 WEC 2013	WEC 2013	WEC 7 WEC 2013 (Bootloader installed)	WEC 7 WEC 2013	WEC 7 WEC 2013	WEC 7 WEC 2013
Memory
Flash	max. 512MB	max. 512MB SLC 32GB eMMC	max. 512MB max. 32GB eMMC opt. SPI NOR opt.I2C EEPROM	max. 32GB	max. 1GB SLC max. 32GB eMMC	max. 1GB
RAM	max. 4GB	max. 4GB DDR3L	max. 2GB	max. 4GB	max. 4GB DDR3	max. 4GB
Interfaces
SD-Card	1x on-board	1x on-board	2x extern	1x extern	1x extern	1x extern/on-board
Ethernet	1x 10/100/1000Mb IEEE1588	1x 10/100/1000Mb IEEE1588	100/1000Mb	10/100/1000Mb IEEE 1588	10/100/1000Mb IEEE 1588	max. 10/100Mb
WiFi		IEEE 802.11a/b/g/n dual band
BT		BT 3.0
USB Host	4x	4x	1x	4x	4x	1-2x
USB Device	1x	1x	1x	1x	1x	1x
CAN	1x	2x	2x	1x	1x	1x
UART	3x	5x	4x	1x	1x	4x
I2C	1x	1x	2x	2x	2x	1x
SPI	1x	2x	2x	1x	1x	1x (Software only)
Audio	Line In/Out/Mic	Line In/Out/Mic	I2S	AC97	AC97	Line In/Out/Mic
Digital I/O	max. 66	max. 66			max. 66	max. 64
Touch Panel	4/5-wire, analog resistive and PCAP Touch via I2C	4/5-wire, analog resistive and PCAP Touch via I2C	analog resistive and PCAP Touch via I2C	via I2C	via AC97	4-wire, analog resistive; PCAP Touch via I2C
Camera analog/digital		0/MIPI-CSI	0/MIPI-CSI or Parallel 8bit	0/1	0/2x MIPI-CSI	0/1
PCIe	1x	1x	1x	1x	1x
SATA	1x	1x	1x	1x	1x
RTC			on board/ external IC
Display
RGB	18bit		18bit			18bit
LVDS	2x 18bit/24bit	2x 18/24bit	2x 24bit	2x 18/24bit	2x 24bit	18bit/24bit
CRT/DVI	0/DVI	0/DVI	0/DVI	0/DVI	0/DVI	0/DVI
Common
Supply Voltage	5V/8-14V DC/±5%	5V DC/±5%	+5VDC/ ±5%	+5VDC/ ±5%	+5V DC/ ±5%	+3.3VDC/+-5%
Power Consumption	4W typ.	4W typ.	2-4W typ.		4W typ.
Operating Temperature	0°C - +70°C opt. -20°C - +85°C	0°C - +70°C opt. -20°C - +85°C	0°C - +70°C opt. -20°C - +85°C	0°C - +70°C opt. -20°C - +85°C opt. -40°C - +85°C	0°C - +70°C opt. -20°C - +85°C opt. -40°C - +85°C	0°C - +85°C opt. -25°C - +85°C opt. -40°C - +85°C
Size	100x72x15mm (lxbxd)	100x72x15mm (LxBxH)	47x62.1x11mm (lxbxd)	70x70x11mm (lxbxd)	70x70x11mm (LxBxH)	80x50x10mm (lxbxd)
Weight	~60g	~60g	~15g	~25g	~25g	~20g
Long Term Availability	2027	2027	2027	2027	2027	2027
	armStone™A9	armStone™A9r2	efus™A9	QBlissA9	QBlissA9r2	PicoMODA9

Modules with NXP i.MX 6SoloX Application Processors

The NXP i.MX 6SoloX is the first processor to use the Arm Cortex-A9 and Cortex-M4 core simultaneously, providing a highly integrated multi-market solution.
It provides a secure implementation to allow simultaneous execution of multiple software environments (e.g. Linux and real-time FreeRTOS)

Click on the board name to get detailed information.

	efus™A9X	PicoCOMA9X	PicoCore™MX6SX
State	Production	Production	Production
CPU
CPU	NXP i.MX 6SoloX	NXP i.MX 6SoloX	NXP i.MX 6SoloX
Core	ARM Cortex-A9 + Cortex-M4	ARM Cortex-A9 + Cortex-M4	ARM Cortex-A9 + Cortex-M4
No of Cores	1 + M4	1 + M4	1 + M4
Frequency	max. 1GHz + 200MHz	max. 1GHz + 200 MHz	max. 800MHz + 200MHz
L2-Cache	256KB	256KB	256KB
GPU	2D, 3D	NEON FPU	3D, 2D
Operating System
Android	Lollipop 5.1.1
Linux	Buildroot Yocto (uboot installed)	Buildroot Yocto (uboot installed)	Buildroot/ Yocto (uboot installiert)
Windows	WEC 2013 (Bootloader installed)	WEC 7 WEC 2013 (EBoot installed)	on request
Real Time	FreeRTOS	FreeRTOS	FreeRTOS
Memory
Flash	max. 512MB max. 32GB eMMC	max. 1GB	max. 512MB SLC NAND oder max. 32GB eMMC
RAM	max. 2GB	max. 512MB	max. 1GB DDR3L
Interfaces
SD-Card	2x extern	1x extern	1x extern
Ethernet	2x 100/1000Mb	1-2x 10/100Mb IEEE 1588	max. 2x 100/1000Mb
WiFi	IEEE802.11 b/g/n/ac*
BT	BT 2.1+EDR 4.0/4.1 with antenna socket opt. chip antenna
USB Host	1x	1x	1x
USB Device	1x	1x	1x OTG 2.0
CAN	2x	1-2x	max. 2x
UART	4x	2-3x	max. 5x
I2C	2x	1x	max. 3x
SPI	2x	1x	max. 2x
Audio	I2S	Line In/Out	Line In/ Out/ Mic/ Headphone/I2S
Digital I/O		max. 48
Touch Panel	analog resitive and PCAP Touch ext. via I2C	4-wire, analog resistive PCAP-Touch via I2C	analog resistive and PCAP Touch ext. via I2C
Camera analog/digital	1/Parallel 8bit
PCIe	1x
RTC	on board/ external IC		external IC
additional Interfaces			max. 8x PWM, SPDIF, ESAI, SAI, SSI ADR/ DATA Bus
Display
RGB	18bit	16/18bit	16/ 24bit
LVDS	1x 24bit opt. 1x 18bit LVDS via MXM2
Common
Supply Voltage	+5VDC/ ±5%	+3,3V DC/ ±5%	+3.8V bis 5.5VDC
Power Consumption	2W typ.	2W typ.	2W typ.
Operating Temperature	0°C - +70°C opt. -20°C - +85°C	0°C - +70°C opt. -40°C - +85°C	0°C - +70°C opt. -20°C - +85°C
Size	47x62.1x11mm (lxbxd)	40x50mm (LxB)	35x40mm (LxB)
Weight	~15g	~15g	~10g
Long Term Availability	2030	2030	2030
	efus™A9X	PicoCOMA9X	PicoCore™MX6SX

Modules with NXP i.MX 6UltraLite/ ULL Application Processors

The i.MX 6ULL/ UltraLite is an energy-efficient and cost-optimized application processor with a Cortex-A7 core that operates at speeds of up to 900 MHz. The CPU includes an integrated power management module that reduces the complexity of an external power supply and simplifies power sequencing. It offers a variety of interfaces for connecting peripheral devices such as WLAN, BT, displays and camera sensors.

Click on the board name to get detailed information.

	efus™A7UL	PicoCOM1.2	PicoCOMA7	PicoCore™MX6UL
State	Production	Production	Production	Production
CPU
CPU	NXP i.MX 6UL/ULL	NXP i.MX 6UL	NXP i.MX 6ULL	NXP i.MX 6ULL
Core	ARM Cortex-A7	ARM Cortex-A7	ARM Cortex-A7	ARM Cortex-A7
No of Cores	1	1	1	1
Frequency	max. 900MHz	max. 696MHz	max. 900MHz	max. 900MHz
L2-Cache	128KB	128KB	128KB	128KB
GPU		NEON
Operating System
Linux	Buildroot Yocto (uboot installed)	Buildroot/Yocto (uboot installed)	Buildroot (uboot installed)	Buildroot/ Yocto (uboot installiert)
Windows	WEC 2013 (Bootloader installed)	WEC 2013 (Bootloader installed	WEC 7 WEC 2013 (Bootloader installed)	auf Anfrage
Memory
Flash	max. 512MB max. 32GB eMMC	max. 1GB SLC NAND	max. 512MB NAND	max. 512MB SLC oder max. 32GB eMMC
RAM	max. 1GB	max. 512MB	max. 1GB	max. 1GB DDR3L
Interfaces
SD-Card	2x extern	1x extern	1x extern	1x extern
Ethernet	2x 10/100Mb	10/100Mb	1-2 10/100MB IEEE1588	max. 2x
WiFi	IEEE802.11b/g/n/ac*
BT	BT 2.1/ EDR 3.0/ 4.1 LE with antenna socket opt. chip antenna
USB Host	1x	1x	1x	1x
USB Device	1x	1x	1x	1x
CAN	2x	2x	1-2x	max. 2x
UART	6x	6x	3x	max. 6x
I2C	4x	2x	1-2x	max. 4x
SPI	4x	2x	1x	max. 4x
Audio	I2S	Line In/Out/analog	Line In/Out	Line In/ Out/ Mic/ Headphone/ I2S
Digital I/O			max. 48
Touch Panel	analog resistive and PCAP Touch ext. via I2C		4-wire, analog resistive PCAP-Touch via I2C	analog resistive und PCAP Touch ext. via I2C
Camera analog/digital	0/parallel 8bit
RTC	on board/ external IC		external IC	external IC
additional Interfaces				max. 8x PWM, SPDIF, ESAI, 3x SAI, SSI ADR/ DATA Bus
Display
RGB	18/24bit		16/18 Bit	24bit
LVDS	opt. 18bit LVDS via MXM2		external
Common
Supply Voltage	+5VDC/ ±5%	+3,3V DC/ ±5%	+3,3V DC/ ±5%	+3.8V bis 5.5VDC
Power Consumption	1-2W typ.		1,5W typ.	1-2W typ.
Operating Temperature	0°C - +70°C opt. -20°C - +70°C -40°C - +85°C	0°C - +70°C opt. -25°C - +85°C	0°C - +70°C opt. -25°C - +85°C	0°C - +70°C opt. -20°C/-40°C - +85°C
Size	47x62.1x11mm (LxBxH)	40x50mm (LxB)	40x50mm (LxB)	35x40mm (LxB)
Weight	~15g	~15g	~15g	~10g
Long Term Availability	2030	2030	2031	2031
	efus™A7UL	PicoCOM1.2	PicoCOMA7	PicoCore™MX6UL

Modules with NXP i.MX 7ULP Application Processor

The i.MX 7ULP is NXP's pioneer in ultra-low power processing for devices with long battery life. Designed for the growing market of portable devices, the i.MX 7ULP processor features advanced implementation of the Arm Cortex-A7 core, Arm Cortex-M4 core, and 3D and 2D Graphics Processing Units (GPUs). The i.MX 7ULP offers a range of interfaces for connecting WLAN, BT, displays and cameras.

Click on the board name to get detailed information.

	PicoCore™MX7ULP
State	Production
CPU
CPU	NXP i.MX 7ULP
Core	ARM Cortex-A7 + Cortex-M4
No of Cores	1 + M4
Frequency	max. 720MHz
L2-Cache	256KB
GPU	3D, 2D
Operating System
Linux	Yocto, Buildroot (uboot installed)
Real Time	FreeRTOS
Memory
Flash	max. 64MB QSPI max. 32GB eMMC
RAM	max. 1GB LPDDR3
Interfaces
SD-Card	1x external
WiFi	802.11 ac/a/b/g/n
BT	5.0 LE
USB Device	1x OTG
UART	5x
I2C	3x
SPI	1x
Audio	Line In/ Out/ Mic/ Headphone
Touch Panel	analog resistive and PCAP Touch ext. via I2C
RTC	external IC
Display
LVDS	
MIPI-DSI	
Common
Supply Voltage	+5VDC/ ±5% / 4.2V Battery
Power Consumption	0,3W typ.
Operating Temperature	0°C - +70°C opt. -20°C - +85°C
Size	35x40mm (LxB)
Weight	~10g
Long Term Availability	2029
	PicoCore™MX7ULP

Modules with NXP QorIQ LS1012A Layerscape Application Processors

Click on the board name to get detailed information.

	efus™A53LS
State	Samples
CPU
CPU	NXP QorlIQ LS1012A (Layerscape)
Core	ARM Cortex-A53
No of Cores	1
Frequency	max. 800MHz
L2-Cache	64 kB
Operating System
Linux	Buildroot Yocto (uboot installed)
Memory
Flash	max. 64MB QSPI NOR
RAM	max. 512MB DDR3L
Interfaces
SD-Card	1x extern (opt.)
Ethernet	2x 100/1000Mb
WiFi	IEEE802.11b/g/n/ac*
USB Host	1x OTG
CAN	1x (opt.)
UART	1x
I2C	2x
SPI	1x (opt.)
Digital I/O	max. 27
PCIe	1x
SATA	1x
RTC	on board/ external IC
additional Interfaces	BT 2.1 + EDR, 4.0/4.1 with antenna socket opt. chip antenna
Display
Common
Supply Voltage	+5VDC/ ±5%
Power Consumption	1W typ.
Operating Temperature	0°C - +70°C opt. -20°C - +85°C
Size	47x62.1x11mm (LxBxH)
Weight	~15g
Long Term Availability	2031
	efus™A53LS

Modules with NXP Vybrid Controllers

Click on the board name to get detailed information.

	armStone™A5	PicoCOMA5	PicoMODA5	PicoMOD1.2	NetDCUA5
State	production	Production	Production	Production	Production
CPU
CPU	NXP Vybrid	NXP Vybrid	NXP Vybrid	NXP Vybrid	NXP Vybrid
Core	ARM Cortex-A5 + Cortex-M4	Cortex-A5 + Cortex-M4	ARM Cortex-A5 + Cortex-M4	Cortex-A5 + Cortex-M4	ARM Cortex-A5 + Cortex-M4
No of Cores	Single-/Dual-Core	Single-/Dual-Core	Single-/Dual-Core	Single-/Dual-Core	Single-/Dual-Core
Frequency	max. 500MHz & 167MHz	max. 500MHz + 167 MHz	max. 500MHz + 167 MHz	max. 500MHz + 167MHz	max. 500MHz + 167MHz
L2-Cache	512KB	512kB	512KB	512KB	512KB
GPU	NEON	NEON FPU	NEON FPU	NEON FPU	NEON
Operating System
Linux	Buildroot (uboot installed)	Buildroot (uboot installed)			Buildroot
Windows	WCE 6.0 WEC 7 WEC 2013	WCE 6.0 R3 WEC 7 WEC 2013 (Bootloader installed)	WEC 7	WCE 6.0 WEC 7 WEC 2013	WCE 6.0 WEC 2013
Real Time		MQX		MQX
Memory
Flash	max. 1GB	max. 1GB	max. 256MB	max.1GB	max. 1GB
RAM	max. 512MB	max. 512MB	256MB	max. 512MB	max. 512MB
Interfaces
SD-Card	1x microSD on-board	extern	1x extern 1x on-board	1x extern	1x on-board
Ethernet	2x 10/100Mb IEEE 1588	2x 10/100MB IEEE 1588	10/100Mb	10/100Mb	2x 10/100Mb IEEE1588
USB Host	1-2x	1-2	1x	1-2x	1x
USB Device	1x	1	1x	1x	1x
CAN	1-2x	1-2	1x		2x
UART	3x	3	3-4x	3x	3x
I2C	1-2x	1-2	1x	1x	1x
SPI	1x	1	1x	1x	1x
Audio	Line In/Out/Mic	Line In/Out	Line In/Out/Mic		Line In/Out/Mic
Digital I/O	max. 66		max. 45		max. 21
Touch Panel	4-wire, analog resistive; PCAP-Touch via I2C	4-wire, analogue resistive; PCAP-Touch via I2C	4-wire, analog resistive PCAP Touch via I2C		4-wire, analog resistive PCAP Touch via I2C
Camera analog/digital			4/0 optional
additional Interfaces		4x 12Bit ADC (opt.)
Display
RGB	18Bit	16/18bit	18bit	18bit	18bit
LVDS	18Bit	extern
Common
Supply Voltage	5V/8-14V DC / ±5%	+3,3V DC/ + - 5%	+3,3V DC/ ±5%	+3,3V DC/ ±5%	+5V DC/ ±5%
Power Consumption	3W typ.	1W typ.	1W typ.	1,5W typ.	1,5W typ.
Operating Temperature	0°C - +70°C opt. -25°C - +85°C	0°C - +70°C opt. -20°C - +85°C	0°C - +70°C	0°C - +70°C	0°C - +70°C opt. -25°C - +85°C
Size	100x72x15mm (lxbxd)	40x50mm (lxb)	80x50mm (lxb)	80x50mm (lxb)	100x80x11mm (lxbxd)
Weight	~55g	~10g	~20g		~45g
Long Term Availability	2023	2023	2023	2023	2023
	armStone™A5	PicoCOMA5	PicoMODA5	PicoMOD1.2	NetDCUA5

Modules with NXP i.MX RT1050 Application Processors

Click on the board name to get detailed information.

	PicoCore™RT1
State	Samples
CPU
CPU	NXP i.MX RT1050
Core	ARM Cortex-M7
No of Cores	1
Frequency	max. 600MHz
L2-Cache	32KB
GPU	2D
Operating System
Real Time	FreeRTOS
Memory
Interfaces
SD-Card	1x external
Ethernet	1
USB Host	1
USB Device	1x OTG 2.0
CAN	max. 2x
UART	max. 3x
I2C	max. 4x
SPI	max. 2x
Audio	Line In/ Out/ Mic/ Headphone/I2S
Touch Panel	analog resistive and PCAP Touch ext. via I2C
RTC	1x
additional Interfaces	PWM, ADC, GPIO
Display
RGB	16bit
Common
Supply Voltage	+3.8V bis 5.5VDC
Power Consumption	1W typ.
Operating Temperature	0°C - +70°C opt. -40°C - +85°C
Size	35x40mm (LxB)
Weight	~10g
Long Term Availability	2031
	PicoCore™RT1

Embedded Modules with NXP i.MX Processors

NXP i.MX 8M, i.MX 8M Mini, i.MX 8M Nano, i.MX 8M Plus

i.MX8 DualX, i.MX 8QuadXPlus

NXP i.MX 6Solo, i.MX 6DualLite, i.MX 6Quad

NXP i.MX 6SoloX

NXP i.MX 6UltraLite (UL), i.MX 6ULL

NXP i.MX 7ULP

NXP QorlQ LS1012A (Layerscape)

NXP Vybrid

NXP i.MX RT1050

Modules with NXP i.MX 8 Application Processor

Modules with NXP i.MX 6 Application Processors

Modules with NXP i.MX 6SoloX Application Processors

Modules with NXP i.MX 6UltraLite/ ULL Application Processors

Modules with NXP i.MX 7ULP Application Processor

Modules with NXP QorIQ LS1012A Layerscape Application Processors

Modules with NXP Vybrid Controllers

Modules with NXP i.MX RT1050 Application Processors

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