OSM

Features

Size-S „Small“ 30x30mm
LGA solder module with 332 contacts
Single power supply 5V
1.8V I/O voltage
Can be soldered on directly
(can be equipped by machine)
Scalable
Standardized interfaces
No connectors

	FS 8MM OSM-SF	FS 8ULP OSM-SF	FS 93 OSM-SF
State	Q2/ 2023	Q4/2023	Q4/2023
CPU	-	-	-
CPU	NXP i.MX 8M Mini	NXP i.MX 8ULP	NXP i.MX 93
Core	ARM Cortex-A53 + Cortex-M4	ARM Cortex-A35 + Cortex-M33 + Hifi 4 DSP	ARM Cortex-A55 + Cortex-M33
No of Cores	1, 2, 4 + M4	1/2 A35 + M33 + Hifi 4 DSP	1, 2 + M33
Frequency	max. 1,8GHz + 400MHz	max. 1GHz + 216MHz + 600MHz	1,7GHz + 250MHz
GPU	2D, 3D	2D, 3D, OpenGL/CL 3.1	PXP
VPU	1080p60 HEVC H.265, VP9, H.264, VP8	-	-
Video	-	Video Encode: 1080p60 HEVC H.265, VP9, H.264, VP8	-
Operating System	-	-	-
Linux	Yocto (uboot installed)	Yocto (uboot installiert)	Yocto (uboot installiert)
Real Time	FreeRTOS	FreeRTOS	FreeRTOS
Memory	-	-	-
Flash	512MB SLC NAND	-	-
eMMC	64GB eMMC	max. 64GB eMMC	32GB eMMC
RAM	4GB LPDDR4	max. 2GB LPDDR4x32	1GB LPDDR4
Interfaces	-	-	-
SD-Card	2x external	2x extern	1x external
Ethernet	1x 100/1000 Mbit	1x RMII	2x RGMII
USB Host	1x 2.0	1x OTG 2.0	1x 2.0
USB Device	1x OTG 2.0	1x OTG 2.0	1x OTG 2.0
CAN	1x	1x	1x CAN-FD
UART	4x	4x	4x
I2C	4x	4x	4x
SPI	2x	2x	2x
Audio	I2S	I2S	I2S
Digital I/O	max. 32	max. 32	-
Touch Panel	analog resistive and PCAP Touch ext. via I2C	Touch via I2C	Touch via I2C
Camera analog/digital	MIPI-CSI	MIPI-CSI (2 lanes)	MIPI-CSI (2lanes)
RTC	1x	1x	1x
additional Interfaces	PWM, Watchdog, SPDIF, ESAI, SAI, SSI	PWM, Watchdog, SPDIF	PWM, SPDIF, ESAI, SAI, SSI
Display	-	-	-
RGB	-	24 bit	-
MIPI-DSI	1x 4 Lanes	1x 4 Lanes	1x 4 Lanes
Common	-	-	-
Supply Voltage	5V DC/±5%	5V DC/±5%	5V DC/±5%
Power Consumption	3W typ.	1W typ.	3W typ.
Operating Temperature	0°C - +70°C opt. -20°C - +85°C	0°C - +70°C opt. -20°C - +85°C	-20°C - +85°C opt. -40°C - +85°C
Size	30x30mm (LxB)	30x30mm (LxB)	35x40mm (LxB)
Weight	~7g	~7g	~7g
Long Term Availability	2029	2035	2035
	FS 8MM OSM-SF	FS 8ULP OSM-SF	FS 93 OSM-SF

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