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efus™

Features

  • 47x62mm
  • Single Voltage 5V
  • RGB/LVDS/DVI
  • MXM2 Goldfinger Connector,
    230 Pins, 0,5mm
  • Kamera, PCIe, SATA, WLAN, BT


efus™A7UL efus™A9 efus™A9X efus™A53LS efus™G1C efus™MX8X
State Production Production Production Samples Samples On request
CPU - - - - - -
CPU NXP i.MX 6UL/ULL NXP i.MX 6 NXP i.MX 6SoloX NXP QorlIQ LS1012A (Layerscape) Renesas RZ/G1C NXP i.MX 8DualX/ QuadXPlus
Core ARM Cortex-A7 ARM Cortex-A9 ARM Cortex-A9 + Cortex-M4 ARM Cortex-A53 ARM Cortex-A7 ARM Cortex-A35 + -M4
No of Cores 1 1, 2, 4 1 + M4 1 2 2x, 4x A35 + M4F
Frequency max. 900MHz max. 1GHz max. 1GHz + 200MHz max. 800MHz max. 1GHz 1.2GHz
L2-Cache 128KB max. 1MB 256KB 64 kB - 512KB (ECC)
GPU - 2D, 3D 2D, 3D - 2D, 3D 2D, 3D (GC7000 Lite, 4 shader)
VPU - 1080p60 - - - 4Kp30
Operating System - - - - - -
Android - - Lollipop 5.1.1 - - -
Linux Buildroot
Yocto
(uboot installed)
Buildroot
Yocto
(uboot installed)
Buildroot
Yocto
(uboot installed)
Buildroot
Yocto
(uboot installed)
Yocto Buildroot/Yocto
(uboot installed)
Windows WEC 2013
(Bootloader installed)
WEC 7
WEC 2013
(Bootloader installed)
WEC 2013
(Bootloader installed)
- - -
Real Time - - FreeRTOS - - FreeRTOS
Memory - - - - - -
Flash max. 512MB
max. 32GB eMMC
max. 512MB
max. 32GB eMMC
opt. SPI NOR
opt.I2C EEPROM
max. 512MB
max. 32GB eMMC
max. 64MB QSPI NOR max. 1MB QSPI
min. 4GB eMMC
max. 512MB QSPI NAND
1MB QSPI NOR
max. 64GB eMMC
eMMC - max.32GB - - - -
RAM max. 1GB max. 2GB max. 2GB max. 512MB DDR3L max. 1GB LPDDR4 32 bit
Interfaces - - - - - -
SD-Card 2x extern 2x extern 2x extern 1x extern (opt.) 1x extern external
Ethernet 2x 10/100Mb 100/1000Mb 2x 100/1000Mb 2x 100/1000Mb 1x 100/1000Mb 2x 100/1000Mb (IEEE 1588, AVB)
WiFi IEEE802.11b/g/n/ac* - IEEE802.11 b/g/n/ac* IEEE802.11b/g/n/ac* IEEE802.11b/g/n/ac* 802.11ac/a/b/g/n
BT BT 2.1/ EDR 3.0/ 4.1 LE
with antenna socket
opt. chip antenna
- BT 2.1+EDR 4.0/4.1
with antenna socket
opt. chip antenna
- BT 2.1 + EDR, 4.0/4.1
with antenna socket
opt. chip antenna
5.0 LE with antenna socket
USB Host 1x 1x 1x 1x OTG 1x 1x USB 2.0 OTG
USB Device 1x 1x 1x - 1x 1x USB 3.0 OTG
CAN 2x 2x 2x 1x (opt.) 1x 2x CAN-FD
UART 6x 4x 4x 1x 4x 4x
I2C 4x 2x 2x 2x 2x 4x
SPI 4x 2x 2x 1x (opt.) 2x 2x
Audio I2S I2S I2S - I2S I2S
Digital I/O - - - max. 27 - -
Touch Panel analog resistive and PCAP Touch ext. via I2C analog resistive and PCAP Touch via I2C analog resitive and PCAP Touch ext. via I2C - analog resistive and PCAP Touch ext. via I2C analog resistive and PCAP Touch ext. via I2C
Camera analog/digital 0/parallel 8bit 0/MIPI-CSI or Parallel 8bit 1/Parallel 8bit - 1/- 0/MIPI-CSI2/ Parallel 8bit
PCIe - 1x 1x 1x - 1x PCIe 3.0 (1 lane)
SATA - 1x - 1x - -
RTC on board/ external IC on board/ external IC on board/ external IC on board/ external IC on board/ external IC on board/ external IC
additional Interfaces - - - BT 2.1 + EDR, 4.0/4.1
with antenna socket
opt. chip antenna
analog Video Out -
Display - - - - - -
RGB 18/24bit 18bit 18bit - - -
LVDS opt. 18bit LVDS via MXM2 2x 24bit 1x 24bit
opt. 1x 18bit LVDS via MXM2
- 24 Bit 2x 24bit
(max.1080p)
CRT/DVI - 0/DVI - - - -
MIPI-DSI - - - - - 2x 4 lanes
(max. 2x1080p)
Common - - - - - -
Supply Voltage +5VDC/ ±5% +5VDC/ ±5% +5VDC/ ±5% +5VDC/ ±5% +5VDC/ ±5% +5VDC/ ±5%
Power Consumption 1-2W typ. 2-4W typ. 2W typ. 1W typ. 3W typ. 3W typ.
Operating Temperature 0°C - +70°C
opt. -20°C - +70°C
-40°C - +85°C
0°C - +70°C
opt. -20°C - +85°C
0°C - +70°C
opt. -20°C - +85°C
0°C - +70°C
opt. -20°C - +85°C
0°C - +70°C
opt. -20°C - +85°C
0°C - +70°C
-20°C - +70°C
-40°C - +85°C
Size 47x62.1x11mm
(LxBxH)
47x62.1x11mm
(lxbxd)
47x62.1x11mm
(lxbxd)
47x62.1x11mm
(LxBxH)
47x62.1x11mm
(LxBxH)
47x62.1x11mm
(LxBxH)
Weight ~15g ~15g ~15g ~15g ~15g ~15g
Long Term Availability 2030 2027 2030 2031 2028 2035
efus™A7UL efus™A9 efus™A9X efus™A53LS efus™G1C efus™MX8X

easy starterkit
workshop
customized WEC2013/ Linux
free support
functional various interfaces
expandable with wireless modules
easy base board
universal visualization
communication
control
small size of 47 x 62mm only
5V power supply

 

From 20 years of project experience we know that the costs of a base board play a key role. Our new standard "EasyLayout" guarantees a low cost carrier board.

EasyLayout describes the concept of no crossing lines or avoidable through holes. The chosen plug connector frees up valuable space on the bottom side of the module.
The schematic data for developing a base board under EAGLE is available.

Another very interesting feature is the opportunity to expand the COM with wireless modules on sideways. Thanks to pre-designed transfer points there is no need to change the layout of the CPU area for an expansion.
Effort and risk are reduced radically.
Possible extensions are WLAN (with chip antenna or socket), ZigBee, Z-Wave as well as EnOcean. Other expansions are conceivable.