Heat Sink PicoCOM
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SKU: MHS.PCOM.1 |
Description
Depending on the CPU used on the PicoCOM module and the application software, the power loss can be multiple Watt. The ambient temperature must also be taken into account. The maximum junction temperature must not be exceeded (can be read out via an SW command and is specified in the hardware documentation).
Technical Data
Available for
- PicoCOM
Scope of Delivery
- 1x Heat Sink (B.MKUE.11) and 1x self-adhesive thermal pad (B.WMLP.8)
- 100 Heat Sink (B.MKUE.11) und 100x self-adhesive thermal pad (B.WMLP.8)
(other quantities available on request))




