Events
We are looking forward to welcome you at our events.
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May 12, 2026 |
Design with NXP Barcelona (ES)Join the Design with NXP Training Program in Barcelona, where engineers receive step-by-step guidance, expert-led lectures, and hands-on workshops tailored to specialized markets. Explore challenging design questions, gain insights into today’s trends, and experience the latest technologies through interactive demos. |
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May 21, 2026 |
Tech Day Stuttgart GermanyAt NXP Technology Days, engineers gain practical insights through expert-led talks, guided training sessions, and interactive workshops. The program focuses on solving real design challenges, exploring emerging trends, and demonstrating the latest technologies in action. |
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September 22-24, 2026 |
embedded world North AmericaVisit us at the embedded world North America in Anaheim CA! We look forward to seeing you! |
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September 29, 2026 |
Design with NXP Copenhagen (DK)Experience the Design with NXP Training Program in Copenhagen, offering engineers step-by-step instruction, in-depth lectures, and practical workshops across focused markets. The program addresses complex design questions, highlights current trends, and showcases cutting-edge technologies through interactive demonstrations. |
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October 01, 2026 |
Design with NXP Stockholm (SE)Be part of the Design with NXP Training Program in Stockholm, featuring step-by-step guidance, expert-led lectures, and hands-on workshops for engineers in specialized markets. Dive into challenging design questions, discover today’s trending topics, and see the latest technologies in interactive demos. |
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October 21, 2026 |
Tech Day Milan, ItalyThe NXP Technology Days program offers engineers practical training through expert-led lectures, step-by-step guidance, and hands-on workshops. The sessions address complex design challenges, highlight key industry trends, and showcase the latest technologies with interactive demos. |
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March 16-18, 2027 |
embedded world 2027 Nurembergsafe the date! Visit us at the embedded world 2027! |
News
May 2017
Embedded Control Europe: COM with NXP i.MX 6 Processor with up to 15 Years Availability
Manhattan Skyline presents the efus™A9 on Embedded Control
Europe, a COM with NXP i. MX 6 processor.
Apr 2017
The Engineer: Computer on Module with NXP i.MX 6SoloX Processor
Highlights of efus™A9X are
– up to 1GB RAM, 1GB NAND Flash and 32GB eMMC
– Wide range of interfaces including Ethernet, USB, CAN,
I²C, SD Card, digital camera
– WLAN/BT optional
– Displays via digital RGB and LVDS
– resistive and capacitive touch via I²C
– Operating systems supported: Linux (Buildroot/ Yocto),
Windows Embedded Compact 2013/ 7 and Android
– Long-term availability to 2025
➜ Read the Article by Manhattan Skyline on The
Engineer[https://www. theengineer.
Apr 2017
Asymmetric Multiprocessing with efus™A9X
efus™A9X is based on a NXP single-core applications
processor from the very successful i. MX 6 series and has a
Cortex-A9, as well as a Cortex-M4 core.
Mar 2017
Components in Electronics: Powerful Single Board Computer armStone™A9r2 and Power-Sipping COM Module efus™A53LS
Our British distributor Manhattan Skyline has published two
advertorials in Components in Electronics. armStone™A9r2 is a compact and very powerful Single Board
Computer in PicoITX format.
Feb 2017
LinuxGizmos.com: Power-Sipping COM with NXP QorIQ LS1012A Layerscape Processor
LinuxGizmos. com has published an article on our efus™
module with Layerscape CPU.
Jan 2017
The Engineer: Computer on Module with NXP QorlQ LS1012A Processor (Layerscape)
The Engineer has intorduced our Layerscape module
efus™A53LS. Product Highlights
NXP QorlQ LS1012A (Layerscape) Processor with Cortex-A53
Core (800MHz).
Jan 2017
efusA53™LS - COM with NXP QorlIQ LS1012A (Layerscape)
The latest member of our efus™ product family is
efus™A53LS. This board comes with the following features:
NXP QorIQ LS1012A (Layerscape)
64 Bit ARM Cortex-A53 @800MHz 64MB NOR Flash, 1GB RAM ECC
protected Cache, NEON, FPU,
ARM TrustZone and Secure Boot SDHC, 2x Gbit Ethernet, 1x USB
3.
Jan 2017
efus™A53LS - COM Module for High-Processing Applications
Our British distributor Manhattan Skyline has introduced our
new efus™A53LS on their website. efus™A53LS is a flexible COM module and suits
high-processing applications.
Jan 2017
Embedded Control Europe: efus™A53LS based on NXP Layerscape CPU
Our latest efus™ module was introduced in Embedded
Control Europe by our British distributor Manhattan Skyline. efus™A53LS is another compact and inexpensive module in
efus™ form factor.
Jan 2017
connectingindustry.com Electronics Magazine: efus™A9 Computer on Module with NXP i.MX 6 Processor
In the latest issue of connectingindustry. com Electronics
magazine, our British distributor Manhattan Skyline has
published an advertorial on efus™A9.



