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  • OSM Size-S Products

    NXP i.MX 8ULP | NXP i.MX 91 | NXP i.MX 93

    NXP i.MX 8M Mini | NXP i.MX 8M Plus

    • assembled on one side
    • 30x30mm
    • cooling solution
  • Design with NXP Copenhagen on September 29, 2026

    Be part of Design with NXP Training in Copenhagen on September 29, 2026 – Interactive Workshops, Insights from Experts & the Latest Innovations!

  • PicoCoreMX8ULP

    • NXP i.MX8ULP Dual Arm®Cortex®-A35 +-M33 + HIFI-4 DSP
    • 2GB LPDDR4, 64GB eMMC, EEPROM, RTC
    • MIPI-DSI or RGB, 2D/3D GPU, MIPI-CSI
    • Audio Codec or I2S, 2x USB, LAN, CAN
    • UART, I2C, SPI
    • Secure Enclave / WLAN 802.11a/b/g/n/ac and BT 5
    • ~5mW in Suspend
  • Why F&S?

    • Free Lifelong Product Care
    • 15+ Years Product Life
    • ISO 13485/2016
    • ISO 9001/2015
    • Industrial and Medical Devices
    • Over 30 years of experience
    • Development and production in Germany
    • Extensive support

HIGHLIGHTS

        • NXP i.MX 95 6x Cortex-A55 + -M7
        • NPU for AI Applications
        • LVDS, DVI (4k), MIPI-DSI
        • USB 3.0, PCIe
        • WLAN 802.11ax and BT 5
        • graphics applications, image processing system
➜learn more about SMARC
  • NXP iMX93 2x Cortex®-A55+M33+NPU (AI)
  • SGeT OSM Size-S (30x30mm)
  • Components on one side 
  • 2GB LPDDR4, 64GB eMMC, 64k EEPROM
  • LVDS or MIPI-DSI, MIPI-CSI
  • 2x RGMII, 2x USB OTG, 2x CAN-FD
  • UART, SPI, I2C, I2S, RTC
    learn more about OSM
  • NXP i.MX8ULP 2x Cortex®-A35+M33+DSP
  • 2GB LPDDR4, 64GB eMMC, EEPROM, pSRAM or Octal SPI Flash, RTC
  • MIPI-DSI or LVDS or RGB, 2D/3D GPU, MIPI-CSI
  • Audio Codec or I2S, 2x USB, LAN, CAN
  • UART, I2C, SPI, WLAN 802.11a/b/g/n/ac and BT 5
  • Secure Enclave
    learn more about PicoCore
  • NXP i.MX93 2x Cortex®-A55+M33+NPU (AI)
  • 2GB LPDDR4, 64GB eMMC, EEPROM, RTC
  • RGB or LVDS or MIPI-DSI, PXP, MIPI-CSI
  • Audio Codec or I2S, 2x Gbit LAN Phy or RGMII, 2x CAN-FD
  • WiFi 6, WLAN802.11ax/ac/a/b/g/n
  • BT 5.2
    learn more about PicoCore

NEWS

Mar 2026

*F&S Elektronik Systeme and QNX Collaborate to Accelerate Development of Next-Generation Medical Devices* F&S to demonstrate a real-time medical application simulation powered by the safety-certified QNX Operating System at Embedded World *Stuttgart, Germany, March 09, 2026* F&S Elektronik Systeme today announced it is collaborating with QNX, a division of BlackBerry Limited (NYSE: BB; TSX: BB), to offer QNX® Operating System (OS) 8. 0 support for the F&S PicoCore™ i.read more...

Mar 2026

*F&S Unveils Multi Form Factor Module Portfolio With Medical and Industrial Demos at Embedded World 2026*  At *Embedded World 2026, NXP® Semiconductors* and *F&S Elektronik Systeme* present a comprehensive, multi form factor embedded module portfolio addressing the growing demand for f*unctional safety, security, and edge AI* across industrial and medical applications. The collaboration showcases production-ready hardware and software platforms ranging from SMARC and M.read more...

Oct 2025

Our white paper helps you evaluate requirements in a structured way and avoid common pitfalls when selecting hardware — from performance and interfaces to security and compliance. ➜ Download the white paper for free.read more...

Agenda


September 29, 2026

Design with NXP Copenhagen (DK)

Experience the Design with NXP Training Program in Copenhagen, offering engineers step-by-step instruction, in-depth lectures, and practical workshops across focused markets. The program addresses complex design questions, highlights current trends, and showcases cutting-edge technologies through interactive demonstrations.

We look forward to seeing you!

➜ More information


October 1, 2026

Design with NXP Stockholm (SE)

Be part of the Design with NXP Training Program in Stockholm, featuring step-by-step guidance, expert-led lectures, and hands-on workshops for engineers in specialized markets. Dive into challenging design questions, discover today’s trending topics, and see the latest technologies in interactive demos.

We look forward to seeing you!

➜ More information


October 21, 2026

Tech Day Mailand (IT)

The NXP Technology Days program offers engineers practical training through expert-led lectures, step-by-step guidance, and hands-on workshops. The sessions address complex design challenges, highlight key industry trends, and showcase the latest technologies with interactive demos.

We look forward to seeing you!

➜ More information


March 16.-18, 2027

embedded world 2027 Nuremberg (DE)

Safe the date!

Visit us at the embedded world 2027

We look forward to seeing you!

➜ more information