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  • OSM Size-S Products

    NXP i.MX 8ULP | NXP i.MX 91 | NXP i.MX 93

    NXP i.MX 8M Mini | NXP i.MX 8M Plus

    • assembled on one side
    • 30x30mm
    • cooling solution
  • Design with NXP Barcelona (ES), May 12, 2026

    Be part of Design with NXP Training in Barcelona on 12 May 2026 – Interactive Workshops, Insights from Experts & the Latest Innovations!

  • Tech Day Stuttgart Germany, May, 21 2026

    Be part of NXP Tech Day on May 21, 2026 in Stuttgart Germany! 

    Come and discover the latest technologies, insightful presentations, and excellent networking opportunities. We’re excited to welcome you!

  • PicoCoreMX8ULP

    • NXP i.MX8ULP Dual Arm®Cortex®-A35 +-M33 + HIFI-4 DSP
    • 2GB LPDDR4, 64GB eMMC, EEPROM, RTC
    • MIPI-DSI or RGB, 2D/3D GPU, MIPI-CSI
    • Audio Codec or I2S, 2x USB, LAN, CAN
    • UART, I2C, SPI
    • Secure Enclave / WLAN 802.11a/b/g/n/ac and BT 5
    • ~5mW in Suspend
  • Why F&S?

    • Free Lifelong Product Care
    • 15+ Years Product Life
    • ISO 13485/2016
    • ISO 9001/2015
    • Industrial and Medical Devices
    • Over 30 years of experience
    • Development and production in Germany
    • Extensive support

HIGHLIGHTS

  • NXP i.MX8M Plus 4x Cortex-A53
  • 8GB LPDDR4, 64GB eMMC, EEPROM
  • RGB, LVDS, DVI (4k)
  • PCIe, MIPI-CSI
  • USB 3.0, USB 2.0, I2S
  • 2x Gbit LAN, I2S, SPI, I2C, UART, 2x CAN-FD
  • WLAN 802.11a/b/g/n/ac and BT 5
    learn more about SMARC
  • NXP iMX93 2x Cortex®-A55+M33+NPU (AI)
  • SGeT OSM Size-S (30x30mm)
  • Components on one side 
  • 2GB LPDDR4, 64GB eMMC, 64k EEPROM
  • LVDS or MIPI-DSI, MIPI-CSI
  • 2x RGMII, 2x USB OTG, 2x CAN-FD
  • UART, SPI, I2C, I2S, RTC
    learn more about OSM
  • NXP i.MX8ULP 2x Cortex®-A35+M33+DSP
  • 2GB LPDDR4, 64GB eMMC, EEPROM, pSRAM or Octal SPI Flash, RTC
  • MIPI-DSI or LVDS or RGB, 2D/3D GPU, MIPI-CSI
  • Audio Codec or I2S, 2x USB, LAN, CAN
  • UART, I2C, SPI, WLAN 802.11a/b/g/n/ac and BT 5
  • Secure Enclave
    learn more about PicoCore
  • NXP i.MX93 2x Cortex®-A55+M33+NPU (AI)
  • 2GB LPDDR4, 64GB eMMC, EEPROM, RTC
  • RGB or LVDS or MIPI-DSI, PXP, MIPI-CSI
  • Audio Codec or I2S, 2x Gbit LAN Phy or RGMII, 2x CAN-FD
  • WiFi 6, WLAN802.11ax/ac/a/b/g/n
  • BT 5.2
    learn more about PicoCore

NEWS

Mar 2026

*F&S Elektronik Systeme and QNX Collaborate to Accelerate Development of Next-Generation Medical Devices* F&S to demonstrate a real-time medical application simulation powered by the safety-certified QNX Operating System at Embedded World *Stuttgart, Germany, March 09, 2026* F&S Elektronik Systeme today announced it is collaborating with QNX, a division of BlackBerry Limited (NYSE: BB; TSX: BB), to offer QNX® Operating System (OS) 8. 0 support for the F&S PicoCore™ i.read more...

Mar 2026

*F&S Unveils Multi Form Factor Module Portfolio With Medical and Industrial Demos at Embedded World 2026*  At *Embedded World 2026, NXP® Semiconductors* and *F&S Elektronik Systeme* present a comprehensive, multi form factor embedded module portfolio addressing the growing demand for f*unctional safety, security, and edge AI* across industrial and medical applications. The collaboration showcases production-ready hardware and software platforms ranging from SMARC and M.read more...

Oct 2025

Our white paper helps you evaluate requirements in a structured way and avoid common pitfalls when selecting hardware — from performance and interfaces to security and compliance. ➜ Download the white paper for free.read more...

Agenda


May 12, 2026

Design with NXP Barcelona (ES)

Join the Design with NXP Training Program in Barcelona, where engineers receive step-by-step guidance, expert-led lectures, and hands-on workshops tailored to specialized markets. Explore challenging design questions, gain insights into today’s trends, and experience the latest technologies through interactive demos.

We look forward to seeing you!

➜ More information


May 21, 2026

Tech Day Stuttgart, Germany

At NXP Technology Days, engineers gain practical insights through expert-led talks, guided training sessions, and interactive workshops. The program focuses on solving real design challenges, exploring emerging trends, and demonstrating the latest technologies in action.

We look forward to seeing you!

➜ Register now


September 22-24, 2026

Embedded World North America

Visit us at the embedded world North America in Anaheim CA!

We look forward to seeing you!

more information


September 29, 2026

Design with NXP Copenhagen (DK)

Experience the Design with NXP Training Program in Copenhagen, offering engineers step-by-step instruction, in-depth lectures, and practical workshops across focused markets. The program addresses complex design questions, highlights current trends, and showcases cutting-edge technologies through interactive demonstrations.

We look forward to seeing you!

➜ More information


October 1, 2026

Design with NXP Stockholm (SE)

Be part of the Design with NXP Training Program in Stockholm, featuring step-by-step guidance, expert-led lectures, and hands-on workshops for engineers in specialized markets. Dive into challenging design questions, discover today’s trending topics, and see the latest technologies in interactive demos.

We look forward to seeing you!

➜ More information


October 21, 2026

Tech Day Mailand (IT)

The NXP Technology Days program offers engineers practical training through expert-led lectures, step-by-step guidance, and hands-on workshops. The sessions address complex design challenges, highlight key industry trends, and showcase the latest technologies with interactive demos.

We look forward to seeing you!

➜ More information


March 16.-18, 2027

embedded world 2027 Nuremberg (DE)

Safe the date!

Visit us at the embedded world 2027

We look forward to seeing you!

➜ more information