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  • OSM Size-S Products

    NXP i.MX 8ULP | NXP i.MX 91 | NXP i.MX 93 | NXP i.MX8M Mini

    • assembled on one side
    • 30x30mm
    • cooling solution
  • PicoCoreMX8ULP

    • NXP i.MX8ULP Dual Arm®Cortex®-A35 +-M33 + HIFI-4 DSP
    • 2GB LPDDR4, 64GB eMMC, EEPROM, RTC
    • MIPI-DSI or RGB, 2D/3D GPU, MIPI-CSI
    • Audio Codec or I2S, 2x USB, LAN, CAN
    • UART, I2C, SPI
    • Secure Enclave / WLAN 802.11a/b/g/n/ac and BT 5
    • ~5mW in Suspend
  • NXP Tech Day Stuttgart 2025

    The NXP Technology Days program offers engineers hands-on workshops, in-depth lectures, and step-by-step guidance on key topics. The sessions are designed to address complex design challenges, explore trending topics, and showcase the latest technology through interactive demos. Join us on May 22, 2025, for this exciting event.

  • Why F&S?

    • Free Lifelong Product Care
    • 15+ Years Product Life
    • ISO 13485/2016
    • ISO 9001/2015
    • Industrial and Medical Devices
    • Over 30 years of experience
    • Development and production in Germany
    • Extensive support

Top Products

  • NXP i.MX8M Plus 4x Cortex-A53
  • 8GB LPDDR4, 64GB eMMC, EEPROM
  • RGB, LVDS, DVI (4k)
  • PCIe, MIPI-CSI
  • USB 3.0, USB 2.0, I2S
  • 2x Gbit LAN, I2S, SPI, I2C, UART, 2x CAN-FD
  • WLAN 802.11a/b/g/n/ac and BT 5
    learn more
  • NXP iMX93 2x Cortex®-A55+M33+NPU (AI)
  • SGeT OSM Size-S (30x30mm)
  • Components on one side 
  • 2GB LPDDR4, 64GB eMMC, 64k EEPROM
  • LVDS or MIPI-DSI, MIPI-CSI
  • 2x RGMII, 2x USB OTG, 2x CAN-FD
  • UART, SPI, I2C, I2S, RTC
    learn more about OSM
  • NXP i.MX8ULP 2x Cortex®-A35+M33+DSP
  • 2GB LPDDR4, 64GB eMMC, EEPROM, RTC
  • MIPI-DSI or RGB, 2D/3D GPU, MIPI-CSI
  • Audio Codec or I2S, 2x USB, LAN, CAN
  • UART, I2C, SPI, WLAN 802.11a/b/g/n/ac and BT 5
  • Secure Enclave
    learn more
  • NXP i.MX93 2x Cortex®-A55+M33+NPU (AI)
  • 2GB LPDDR4, 64GB eMMC, EEPROM, RTC
  • RGB or LVDS or MIPI-DSI, PXP, MIPI-CSI
  • Audio Codec or I2S, 2x Gbit LAN Phy or RGMII, 2x CAN-FD
  • WiFi 6, WLAN802.11ax/ac/a/b/g/n
  • BT 5.2
    learn more

NEWS

Apr 2025

Herr Froelich Interview

lvglvideobild   F&S offers support for LVGL (Light and Versatile Graphics Library) across its NXP i. MX based embedded platforms.read more...

Apr 2025

jeffsteinheider 002

Watch our interview with Jeff Steinheider (General Manager Industrial Edge Processing Product Line at NXP) introducing the latest i. MX 93 and i.read more...

Mar 2025

AK 2

According to Andreas Kopietz, Sales Director at F&S Elektronik Systeme, our CoMs featuring the powerful i. MX93 and i.read more...

Agenda

 

 22. May 2025

Tech Day Stuttgart 

The NXP Technology Days Training offers engineers hands-on workshops, exciting presentations, and step-by-step guides on current topics. Design questions are addressed, trends are discussed, and the latest technology is showcased in interactive demos.

➜more information 

 

03. June 2025

 NXP DFAE Americas Partner Night 2025

The NXP Americas DFAE Technical Training event is intended to equip our distribution FAE partners with the expertise needed to win with and support customers on the latest NXP products and technologies.

 

30. September 2025

Tech Day Boston 

The NXP Technology Days program is aimed at engineers and offers a mix of hands-on workshops, in-depth presentations, and step-by-step guides on current topics. Design challenges are addressed, trends are presented, and the latest technology is brought to life through interactive demos.

➜more information

 

10.-12. March 2026

Embedded World Nürnberg

Save the date!

Visit us from March 10-12, 2026, at Embedded World in Nuremberg.

➜ More information embedded world